Classification, performance characteristics, and application analysis of epoxy resin adhesives

Epoxy resin adhesive is formulated with epoxy resin as the main body. The resin macromolecules have epoxy groups at the end, hydroxyl and ether bonds between the chains, and continuously generate hydroxyl and ether bonds during the curing process. The structure contains benzene rings and heterocycles, which determine the excellent performance of epoxy resin adhesives. Epoxy resin adhesive is a widely used adhesive with a long history of use. Epoxy resin adhesives have been widely recognized by users due to their strength, diversity, and excellent adhesion to various adhesive surfaces. We have participated in and accelerated technological revolutions in some industrial fields. Epoxy resin can be used to bond metal, glass, ceramics, many plastics, wood, concrete, and other surfaces.
More than 10% of epoxy resins produced in the United States are used as adhesives. In the past, the modification of epoxy resin was limited to rubber, such as carboxyl terminated Nitrile rubber, hydroxyl terminated Nitrile rubber, polysulfide rubber, etc. In recent years, the modification of epoxy resin has been continuously deepened, and the modification methods have changed rapidly, such as interpenetrating network method, chemical copolymerization method, etc., especially the liquid crystal toughening method and nanoparticle toughening method, which have become research hotspots in recent years. With the establishment of the development model of "scale, high purification, refinement, specialization, serialization, and functionalization", the research on epoxy resin modification is changing rapidly and has become the focus of industry attention. It will promote the further and wider application of epoxy resin in economic construction and people's lives.
Heat-resistant epoxy resin adhesive is a type of adhesive prepared with modified epoxy resin. It can be used intermittently at 250 ℃, long-term at 400 ℃, and short-term at 460 ℃. The matrix resin of this adhesive generally introduces more rigid groups or increases the crosslinking density of the cured product. For example, epoxy resin containing fluorene group, naphthalene ring and multifunctional group, or epoxy resin adhesive modified with maleimide Imide and organic silicon can meet the requirements of 460 ℃ short-term high temperature resistance and high strength. In recent years, with the development of the electronics and aerospace industries, the requirements for high temperature and ablation resistance have become increasingly high. When flying at high speeds in the atmosphere, sometimes the aerodynamic heating temperature can reach thousands of degrees, and even the most heat-resistant metal materials need to be melted. Therefore, in order to reduce weight, high-temperature resistant composite materials are generally used instead of metal materials. Even in the electronic and electrical industry, sealants that can withstand high temperatures of 350 ℃ have been proposed one after another, and even flame-retardant insulation adhesives that can withstand high temperatures of 500~1000 ℃ have been proposed. F series epoxy curing agent developed by China National Aviation Holding and B, H, HE series epoxy curing agent newly developed can make the epoxy resin resistant to 500 ℃ high temperature, and have excellent flame retardancy, ablation resistance and excellent process performance.

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