place of origin: China
Transportation: Ocean
Port: shanghai
High purity low chlorine liquid epoxy resin
Product introduction：
High-purity, low-chlorine liquid epoxy resin is a specialized type of epoxy resin that is widely used in applications where purity is a critical factor, such as in the semiconductor industry and other high-tech applications. This type of epoxy resin is made using a specialized manufacturing process that ensures a high degree of purity and low levels of chlorine impurities.
One of the key benefits of using high-purity, low-chlorine liquid epoxy resin is its high degree of purity. This makes it an ideal choice for use in applications where even small amounts of impurities can have a significant impact on performance, such as in the semiconductor industry.
Another benefit of high-purity, low-chlorine liquid epoxy resin is its versatility. It can be used in a wide range of applications, from industrial coatings to electronic components. Its clear surface allows for a range of creative possibilities, as artists can layer different colors and materials within the resin to create unique and captivating effects.
High-purity, low-chlorine liquid epoxy resin is also highly resistant to chemicals and other environmental factors. This makes it an ideal choice for use in harsh environments or in applications where exposure to chemicals or other corrosive substances is a concern.
However, it is important to note that high-purity, low-chlorine liquid epoxy resin can be dangerous if not handled correctly. The resin system typically contains harmful chemicals that can release harmful fumes and cause skin irritation if not handled with care. It is important to wear protective gloves and a respirator mask when working with the material.
In conclusion, high-purity, low-chlorine liquid epoxy resin is a specialized and versatile material that is widely used in a range of industrial, commercial, and artistic applications. Its high degree of purity, versatility, and resistance to environmental factors make it an ideal choice for use in applications where purity and performance are critical factors. However, it is important to handle the material with care to avoid any potential health hazards.
NAN YA Epoxy Resins
|
Name |
Epoxyequivalent (g/eq) |
Color (G) Max |
Viscosity (cps@25℃) |
Characteristic |
Application |
|
NPEL- 128 |
184 - 190 |
1 |
12000 - 15000 |
Standard epoxy resin |
Building、 Coating、 Link |
|
NPEL- 128E |
184 - 190 |
1 |
12000 - 15000 |
Standard electron epoxy resin |
Electron |
|
NPEL-128G |
184 - 190 |
1 |
12000 - 15000 |
Total chlorine<1550PPM |
Electron |
|
NPEL-128R |
184 - 194 |
1 |
12000 - 16000 |
Low crystalline type |
Building、 Coating、 Link |
|
NPEL-128S |
205 - 275 |
1 |
19000 - 24000 |
Amorphous type |
Building、 Coating、 Link |
|
NPEL -127 |
176 - 184 |
1 |
8000 - 11000 |
Low standard Viscosity resin |
Building、 Coating、 Link、 Potting |
|
NPEL -144 |
210 - 220 |
1 |
Semi-solid |
High performance basic epoxy resin |
Coating、 Potting、 Adhesive |
|
NPEF -170 |
160 - 180 |
3 |
2000 - 5000 |
Bisphenol F standard |
Electron |
|
NPSN-301X75 |
450- 500 |
1 |
6000 -14000 |
Xylene dilution |
Coating |
|
NPSN-901X75 |
450- 500 |
1 |
8000 -15000 |
Xylene dilution |
Coating |
|
NPSN-134X80 |
230 - 270 |
1 |
800 -1400 |
80% xylene solution |
Coating |
|
NPER -133L |
195 - 240 |
1 |
10000 - 16000 |
Flexible EPU denaturation |
Link |
|
NPER - 450 |
400- 500 |
12 |
250000 - 400000 |
Rubber modified epoxy |
CFRP、 Building、Coating |
|
NPER - 032 |
305 - 335 |
1 |
35- 80 |
Dicycloxy diluent |
Adhesive、 Coating、 Electron |
|
NPEX -153K75 |
280 - 305 |
7- 9 |
500 -2500 |
Isocyanate modified epoxy resin |
Copper clad laminate、 Composite material |
|
Name |
Epoxyequivalent (g/eq) |
Color(G)Max |
Softening point(℃) |
Characteristic |
Use |
|
NPCN -701 |
190 - 215 |
3 |
60 - 64 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -702 |
190 - 215 |
3 |
65 - 74 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -702H |
195 - 210 |
2 |
71 - 78 |
O-cresol epoxy |
Composite material 、Copper clad laminate 、Printing ink |
|
NPCN -703 |
195 - 225 |
5 |
75 - 85 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -704 |
200 - 230 |
5 |
85 - 95 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -704H |
220 - 220 |
3 |
95 -100 |
O-cresol epoxy |
Composite material 、Copper clad laminate 、Printing ink |
|
NPCN -704L |
200 - 210 |
5 |
82 - 90 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -704K80 |
200 - 230 |
5 |
Viscosity 6000-15000cps |
cresol epoxy + Methyl ethyl ketone |
Composite material 、Laminate 、Printing ink |
|
Name |
Epoxyequivalent(g/eq) |
Dissolved viscosity |
Softening point ( °C) |
Color (G)Max |
Application |
|
NPES -301H |
530 - 570 |
F - J |
65 - 75 |
1 |
Coating |
|
NPES -302 |
600 - 700 |
G - K |
82 - 92 |
1 |
Powder Coating |
|
NPES -901 |
450 - 500 |
D - F |
64 - 74 |
1 |
For lamination，Good water resistance |
|
NPES -902 |
600 - 650 |
1 -M |
82 - 92 |
1 |
Coating |
|
NPES -903 |
700 - 750 |
N- R |
90 - 98 |
1 |
Powder coating |
|
NPES-903H |
740 - 800 |
P - S |
92 - 100 |
1 |
Powder coating |
|
NPES -904 |
780 - 850 |
S -W |
96 - 107 |
1 |
Powder coating ，Epoxy ester Coating |
|
NPES - 609 |
2400 - 3000 |
- |
135- 150 |
1 |
Flexibility，Canning、Baking varnish Coating |
|
NPES -907 |
1500 - 1800 |
Z -Z2 |
120- 130 |
1 |
Canning、Baking varnish Coating |
|
NPES -909 |
1800 - 2500 |
Z3-Z5 |
130- 150 |
1 |
PCM，Canning、Baking varnish Coating |
|
Name |
Epoxyequivalent (g/eq) |
Color (G)Max |
Viscosity (cps25℃) |
Characteristic |
Use |
|
NPPN-631 |
168 - 178 |
2 |
1100 -1700/52°C |
Phenolic epoxy, good temperature resistance and chemical resistance |
Laminate、Winding、Composite material |
|
NPPN-638S |
170 - 190 |
3 |
Semi-solid |
Phenolic epoxy, good temperature resistance and chemical resistance |
Laminate、Winding、Composite material |
|
NPPN-431 |
200 - 240 |
9-13 |
Softening point 82-92°C |
Tetrafunctional phenolic resin |
Copper clad laminate、Composite material |
|
NPPN-438 |
185 - 210 |
2 |
Softening point60-68°C |
Bisphenol A phenolic resin |
Printing ink、Copper clad laminate、Composite material |
|
NPPN-431A70 |
200 - 240 |
Brown |
50-200 |
Four functional groups, heat resistance and UV resistance |
IC encapsulation、 Laminate、 Heat resistant modifier |
|
Name |
Epoxyequivalent (g/eq) |
Color ( G ) |
Hydrolyzable chlorine ( PPM) |
N.V% |
Application |
|
NPPN-260A80 |
190 - 210 |
Reddish brown |
≤ 500 |
80±1 |
Phenolic epoxy Low Dk containing acetone Solvent |
|
NPPN-272H |
260 -285 |
Brown |
≤ 300 |
78- 88℃ ( Softening point ) |
Dicyclopentadiene phenol type epoxy resin, excellent low dielectric constant and low water absorption |
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