place of origin: China
Transportation: Ocean
Port: shanghai
Epoxy Totalboat for printed circuit boards
Product introduction：
Epoxy resin is a popular choice for printed circuit board (PCB) manufacturing due to its many advantages. It is known for its excellent adhesion properties, high thermal stability, and resistance to moisture, chemicals, and environmental factors.
One of the primary benefits of epoxy resin for PCB manufacturing is its ability to bond strongly to copper and other metal substrates. This makes it ideal for use in the production of PCBs, which rely on a strong bond between the metal traces and the substrate.
Another advantage of epoxy resin for PCB manufacturing is its high thermal stability. It can withstand exposure to high temperatures without losing its physical properties, making it ideal for use in applications where heat dissipation is critical, such as in power electronics.
Epoxy resin for PCB manufacturing is also highly resistant to environmental factors. It is resistant to moisture, chemicals, and UV radiation, which makes it ideal for use in harsh environments. It can withstand exposure to a wide range of chemicals, including acids and alkalis, without losing its physical properties.
In addition to its practical advantages, epoxy resin for PCB manufacturing is also highly customizable. It can be formulated to have different levels of viscosity, curing time, and other properties. This allows manufacturers to create products that meet the unique needs of their customers.
Overall, epoxy resin is a practical and highly effective solution for PCB manufacturing. Its strength, durability, and resistance to environmental factors make it an ideal choice for use in many different settings. With its customizable properties, it is likely to continue to be a popular choice for manufacturers across a broad range of industries.
NAN YA Epoxy Resins
|
Name |
Epoxyequivalent (g/eq) |
Color (G) Max |
Viscosity (cps@25℃) |
Characteristic |
Application |
|
NPEL- 128 |
184 - 190 |
1 |
12000 - 15000 |
Standard epoxy resin |
Building、 Coating、 Link |
|
NPEL- 128E |
184 - 190 |
1 |
12000 - 15000 |
Standard electron epoxy resin |
Electron |
|
NPEL-128G |
184 - 190 |
1 |
12000 - 15000 |
Total chlorine<1550PPM |
Electron |
|
NPEL-128R |
184 - 194 |
1 |
12000 - 16000 |
Low crystalline type |
Building、 Coating、 Link |
|
NPEL-128S |
205 - 275 |
1 |
19000 - 24000 |
Amorphous type |
Building、 Coating、 Link |
|
NPEL -127 |
176 - 184 |
1 |
8000 - 11000 |
Low standard Viscosity resin |
Building、 Coating、 Link、 Potting |
|
NPEL -144 |
210 - 220 |
1 |
Semi-solid |
High performance basic epoxy resin |
Coating、 Potting、 Adhesive |
|
NPEF -170 |
160 - 180 |
3 |
2000 - 5000 |
Bisphenol F standard |
Electron |
|
NPSN-301X75 |
450- 500 |
1 |
6000 -14000 |
Xylene dilution |
Coating |
|
NPSN-901X75 |
450- 500 |
1 |
8000 -15000 |
Xylene dilution |
Coating |
|
NPSN-134X80 |
230 - 270 |
1 |
800 -1400 |
80% xylene solution |
Coating |
|
NPER -133L |
195 - 240 |
1 |
10000 - 16000 |
Flexible EPU denaturation |
Link |
|
NPER - 450 |
400- 500 |
12 |
250000 - 400000 |
Rubber modified epoxy |
CFRP、 Building、Coating |
|
NPER - 032 |
305 - 335 |
1 |
35- 80 |
Dicycloxy diluent |
Adhesive、 Coating、 Electron |
|
NPEX -153K75 |
280 - 305 |
7- 9 |
500 -2500 |
Isocyanate modified epoxy resin |
Copper clad laminate、 Composite material |
|
Name |
Epoxyequivalent (g/eq) |
Color(G)Max |
Softening point(℃) |
Characteristic |
Use |
|
NPCN -701 |
190 - 215 |
3 |
60 - 64 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -702 |
190 - 215 |
3 |
65 - 74 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -702H |
195 - 210 |
2 |
71 - 78 |
O-cresol epoxy |
Composite material 、Copper clad laminate 、Printing ink |
|
NPCN -703 |
195 - 225 |
5 |
75 - 85 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -704 |
200 - 230 |
5 |
85 - 95 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -704H |
220 - 220 |
3 |
95 -100 |
O-cresol epoxy |
Composite material 、Copper clad laminate 、Printing ink |
|
NPCN -704L |
200 - 210 |
5 |
82 - 90 |
O-cresol epoxy |
Composite material 、Coating 、Molding Composite |
|
NPCN -704K80 |
200 - 230 |
5 |
Viscosity 6000-15000cps |
cresol epoxy + Methyl ethyl ketone |
Composite material 、Laminate 、Printing ink |
|
Name |
Epoxyequivalent(g/eq) |
Dissolved viscosity |
Softening point ( °C) |
Color (G)Max |
Application |
|
NPES -301H |
530 - 570 |
F - J |
65 - 75 |
1 |
Coating |
|
NPES -302 |
600 - 700 |
G - K |
82 - 92 |
1 |
Powder Coating |
|
NPES -901 |
450 - 500 |
D - F |
64 - 74 |
1 |
For lamination，Good water resistance |
|
NPES -902 |
600 - 650 |
1 -M |
82 - 92 |
1 |
Coating |
|
NPES -903 |
700 - 750 |
N- R |
90 - 98 |
1 |
Powder coating |
|
NPES-903H |
740 - 800 |
P - S |
92 - 100 |
1 |
Powder coating |
|
NPES -904 |
780 - 850 |
S -W |
96 - 107 |
1 |
Powder coating ，Epoxy ester Coating |
|
NPES - 609 |
2400 - 3000 |
- |
135- 150 |
1 |
Flexibility，Canning、Baking varnish Coating |
|
NPES -907 |
1500 - 1800 |
Z -Z2 |
120- 130 |
1 |
Canning、Baking varnish Coating |
|
NPES -909 |
1800 - 2500 |
Z3-Z5 |
130- 150 |
1 |
PCM，Canning、Baking varnish Coating |
|
Name |
Epoxyequivalent (g/eq) |
Color (G)Max |
Viscosity (cps25℃) |
Characteristic |
Use |
|
NPPN-631 |
168 - 178 |
2 |
1100 -1700/52°C |
Phenolic epoxy, good temperature resistance and chemical resistance |
Laminate、Winding、Composite material |
|
NPPN-638S |
170 - 190 |
3 |
Semi-solid |
Phenolic epoxy, good temperature resistance and chemical resistance |
Laminate、Winding、Composite material |
|
NPPN-431 |
200 - 240 |
9-13 |
Softening point 82-92°C |
Tetrafunctional phenolic resin |
Copper clad laminate、Composite material |
|
NPPN-438 |
185 - 210 |
2 |
Softening point60-68°C |
Bisphenol A phenolic resin |
Printing ink、Copper clad laminate、Composite material |
|
NPPN-431A70 |
200 - 240 |
Brown |
50-200 |
Four functional groups, heat resistance and UV resistance |
IC encapsulation、 Laminate、 Heat resistant modifier |
|
Name |
Epoxyequivalent (g/eq) |
Color ( G ) |
Hydrolyzable chlorine ( PPM) |
N.V% |
Application |
|
NPPN-260A80 |
190 - 210 |
Reddish brown |
≤ 500 |
80±1 |
Phenolic epoxy Low Dk containing acetone Solvent |
|
NPPN-272H |
260 -285 |
Brown |
≤ 300 |
78- 88℃ ( Softening point ) |
Dicyclopentadiene phenol type epoxy resin, excellent low dielectric constant and low water absorption |
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