Epoxy adhesive with excellent performance

Bonding (Bonding, Bonding, Bonding) refers to the technique of using adhesives to bond the surfaces of homogeneous or heterogeneous objects together. It has the characteristics of continuous stress distribution, light weight, or sealing, and most processes have low temperatures. Adhesive bonding is particularly suitable for connecting complex components with different materials, thicknesses, ultra-thin specifications. Adhesive bonding has the fastest development in modern times and is widely used in various industries, which has a significant impact on the progress of high-tech and the improvement of people's daily lives. Therefore, research, development, and production of various adhesives are very important.
Epoxy resin adhesive is a general term that contains two or more epoxy groups in the molecular structure and can form three-dimensional cross-linking curing compounds under appropriate chemical reagents and conditions.
Epoxy resin adhesive is a liquid or solid adhesive composed of epoxy resin, curing agent, plasticizer, promoter, diluent, filler, coupling agent, flame retardant, stabilizer, etc. Epoxy resin, curing agent, and toughening agent are indispensable components, while others can be added or not added as needed. The bonding process of epoxy adhesive is a complex physical and chemical process, including wetting, bonding, curing and other steps, which ultimately produces a three-dimensional cross-linked structure of cured materials, and combines the adhesive into a whole.
There are many types of epoxy adhesives, among which bisphenol A epoxy resin has the largest production and the most widely used. According to their molecular weight, they can be divided into low, medium, high, and ultra-high molecular weight epoxy resins (polyphenolic epoxy resins). Low molecular weight resins can cure at room temperature or high temperatures, but high molecular weight epoxy resins must cure at high temperatures, while ultra-high molecular weight phenolic resins do not require curing agents and can form tough films at high temperatures. With the advance of various adhesive theories and basic research work, such as adhesive chemistry, adhesive Rheology, adhesive failure mechanism, etc., the properties, varieties and applications of adhesives have been developed by leaps and bounds. Epoxy resin and its curing system have also become important adhesive types with excellent performance, numerous varieties, and wide adaptability due to their unique and excellent performance, as well as the continuous emergence of new epoxy resins, curing agents, and additives.
Epoxy adhesive mainly consists of two parts: epoxy resin and curing agent. In order to improve certain properties and meet different applications, auxiliary materials such as toughening agents, diluents, accelerators, coupling agents, etc. can also be added. Epoxy adhesive has been widely used in various fields such as aviation, aerospace, automotive, machinery, construction, chemical, light industry, electronics, electrical appliances, daily life, etc. due to its high bonding strength and strong universality.
With the increasingly sound environmental regulations in China and the improvement of people's own health awareness, environmentally friendly epoxy adhesives with good quality, pollution-free, and compliance with international standards are gradually becoming the mainstream product of synthetic adhesives.

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